With the dramatic increase in the amount of data processed by electronic devices such as smartphones, medical equipment, and automobiles, the signal transmission speed of these devices has also reached unprecedented heights. However, this also brings challenges of electromagnetic interference (EMI). EMI is non essential electromagnetic noise generated internally or externally by devices. It may not only originate from digital timing signals or electronic components within the device, but also cause interference to components within other systems, leading to electromagnetic compatibility (EMC) issues.

When designing these high-performance devices, engineers often face EMI challenges, especially in systems that integrate high-density electronic components. When these devices are interconnected using connectors, EMI shielding of the connectors is particularly important to prevent electromagnetic noise from adversely affecting the system. Rubber sealing ring for energy storage power supply

It is worth noting that the connectors themselves do not generate EMI, so they will not cause electromagnetic noise pollution to the outside world. However, they may become a pathway for EMI propagation and therefore require appropriate shielding treatment.

EMI typically propagates through two paths: radiated interference and conducted interference.

Radiation interference occurs when high-frequency signals are transmitted on conductive surfaces such as wires or printed circuit board (PCB) tracks, generating electromagnetic fields that radiate outward and may cause interference to other devices.

Conducted interference refers to the direct transmission of signals from one location to another through conductors (such as wires or PCB tracks), which interferes with the normal operation of the target circuit or equipment.

In order to mitigate the impact of EMI, engineers have adopted various EMI mitigation techniques, including designing appropriate grounding structures and cover layers on connectors. These technologies not only involve the installation position of the signal contact tail, but also the setting of the metal shielding layer. In devices equipped with wireless communication functions such as Wi Fi, GPS, and LTE, shielded micro coaxial, micro RF, board to board, and FFC/FPC connectors have been widely used to effectively prevent EMI interference. What is the sealing rubber silicone material

ZenShield with I-PEX ® For example, it adopts a 360 ° shielding design, which not only prevents electromagnetic noise radiation from the contact points of the plug and socket, but also prevents radiation from the board mounting part (SMT position) of the signal terminal. When the connectors are paired and properly grounded, the shielding layers of the plug and socket are connected at multiple points, ensuring that the current generated in the metal shielding layer has sufficient grounding return paths, thereby suppressing the emission of electromagnetic noise from the shielding layer.

To achieve effective EMI mitigation, the connector design should have the following three characteristics: the entire connector should be covered with 360 ° all-round shielding; The shielding interface between the plug and socket should be effectively connected at multiple points; The interface between the connector shielding layer and the circuit board should be properly grounded at multiple points on the circuit board to improve the grounding return path. Rubber seals and plastic components for new energy batteries

Through these design features, the connector itself can significantly reduce electromagnetic interference, giving design engineers greater flexibility in circuit board layout, especially in situations where proximity to sensitive subsystems such as wireless communication transmit/receive antennas is required.